ANSI SP27.1:2018 pdf download.Recommended Information Flow for Potential EOS Issues between Automotive OEM, Tier 1, andSemiconductor Manufacturers.
This document applies to any electronic component, module, or assembly exhibiting electrically induced physical damage (EIPD) that is suspected to be a result of EQS.
2.0 REFERENCED PUBLICATIONS
Unless otherwise specified, the following documents of the latest issue, revision, or amendment
form a part of this standard to the extent specified herein:
ESD ADV 1.0, ESD Association’s Glossary of Terms.2
3.0 DEFINITION OF TERMS
The terms used in the body of this document are in accordance with the definitions found in ESD ADVI.O, ESD Association’s Glossary of Terms, available for complimentary download at www.esda.org.
design validation or design verification (DV). Verifying the design of the electronic component or the module without including the effects of automotive manufacturing induced variations in the module and vehicle production.
diagnostic trouble code (DTC). DTC codes that are described by Society of Automotive Engineers (SAE) standards to help track problems in a vehicle detected by its on-board computer.
electronic control unit (ECU). An embedded electronic system that controls one or more electrical systems or subsystems in a vehicle.
NOTE: An ECU typically includes one or more printed circuit board assemblies (PCBA’s).
electrically induced physical damage (EIPD). Damage to an electronic component due to electrical/thermal stress beyond the level which the materials could sustain.
NOTE: This would include melting of silicon, fusing of metal interconnects, thermal damage to package material, fusing of bond wires and other damage caused by excess current or voltage.
NOTE: The term EIPD has to be used during initial failure analysis/failure investigation until a more comprehensive joint analysis between supplier and customer has confirmed a potential EQS event.
NOTE: Thermal stress is assumed to be a consequence of electrical stimulation.
electronic component. In the context of this document an electronic component describes an integrated circuit (IC), a semiconductor device, a passive device, or a discrete device.
electrical overstress (EOS). An electrical device suffers electrical overstress when a maximum limit for either the voltage across, the current through, or the power dissipated in the device is exceeded and causes immediate damage or malfunction, or latent damage resulting in an unpredictable reduction of its lifetime.
NOTE: EQS does not define the root cause of a failure.
end of line test (EOL). EOL is a test method for finished products at the end of production before shipment.
errata sheet. In the context of this document, an errata sheet describes known functional problems as well as deviations from the electrical specifications listed in the product description or data sheet. in circuit test (ICT). ICT is a test method for PCBAs, where the PCBA is tested for failures in circuits (for example, open or short) and for damage of the electronic component.
NOTE: ICT is done after placement of the components before the PCBA is placed into a housing.
look across. Look across is a process to review or evaluate a failure mode and determine if additional users are impacted.
NOTE: The users could be different OEM assembly plants or vehicle programs or vehicle repair facilities. Users could be different Tier 1 suppliers involving different programs or manufacturing facilities. It could also be different semi-conductor manufacturing locations, processes or equipment.ANSI SP27.1 pdf download.